[Pre-Order] HG SEED R07 MOBILE CGUE

BANDAISKU: MDL-BND-2156405

Price:
$15

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Description

[Pre-Order]

JP Available Month: December 2026
Estimate US Available Month: January - March 2027

  • Estimate Shipping Date might be changed
    * US release date is usually 2-3 months later than JP release date
    * Orders includes pre-order items will be shipped once all items become available. 
    * PLEASE see and agree with the Shipping Policy

Bandai Hobby Mobile Suite Gundam Model Kit

• The Gunpla HG series has been completely renewed to coincide with the HD remaster of Mobile Suit Gundam SEED.

• Newly included attachment parts allow the model to connect to Action Base 2 (sold separately), making it possible to recreate dynamic action poses characteristic of the SEED series.

• New marking stickers are included for added detail and customization.

• The packaging design has been revamped.

• The molded colors have been updated to more faithfully reproduce the colors seen in the anime.

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